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Thermally Conductive Polyimide Film: A Better Way to Dissipate Heat of Electronic Devices
Date: 2020/09/11 Author: WANG Yanyan

A study team developed highly thermally conductive polyimide film with superior flexibility and electrical insulation. This work was done by Prof. TIAN Xingyou and ZHANG Xian from Institute of Solid State Physics, Hefei Institutes of Physical Science.

 
In this work, researchers use facile imidization-induced orientation method to fabricate layered PI/carbon nitride nanosheets (PI/CNNS) flexible nanocomposite films.

 
CNNS realized in-plane self-orientation during solvent evaporation to form continuous thermal pathway in PI film basing on the orientation of PI molecules during imidization and strong interaction with PI.

 
The results showed that the in-plane thermal conductivity of PI/CNNS nanocomposite film reached up to 2.04 Wm-1K-1 with low CNNS loading (20 wt%) which was about eleven times of the corresponding pure PI.

  
Furthermore, the potential application of the PI/CNNS nanocomposite films for effective heat dissipation was confirmed by experiments and simulation. The PI/CNNS nanocomposite films kept superior electrical insulation property and thermal stability.

 
Efficient heat management is essential to dissipate excessive heat in improving the efficiency and reliability of electronic devices. And in recent years, polymer materials have been widely used as substrate of microelectronics due to low cost, light weight and easy processing, with polyimide (PI) film being considered as a desired material for OLED flexible substrate.

 
However, limited by its low thermal conductivity (0.18 Wm-1K-1), PI usually needs to combine with highly thermally conductive fillers to strengthen its thermal conductivity.

 
This work expands the application of CNNS and provides a facile, efficient approach to the design of high thermal conductive materials.

 
The research was supported by the National Key Research and Development Program of China, Key Project of Science and Technology ServiceNetwork Initiative of the Chinese Academy of Sciences and Anhui Provincial Natural Science Foundation.

 
Link to the paper: Imidization-induced carbon nitride nanosheets orientation towards highly thermally conductive polyimide film with superior flexibility and electrical insulation

Figure 1 (a) The schematic diagram of PI/CNNS nanocomposite films; (b) the thermal conductivity and photographs of PI/CNNS nanocomposite films. (Image by WANG Yanyan)

Contact:

ZHOU Shu
Hefei Institutes of Physical Science (http://english.hf.cas.cn/)
Email: zhous@hfcas.ac.cn

 

 

 

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